Method of manufacturing airtight terminal

Abstract

Abstract PURPOSE:To effect the plating work with ease and eliminate the fear of oxidation by a method wherein a lead wire with an Ni plated coating is fixed with glass sealing to a metal outer ring which is not yet subjected to plating treatment, and then Ni plating is effected on the metal outer ring. CONSTITUTION:All over the surface of a lead wire 5 is covered with an electrically plated Ni coating. Then, this lead wire 5 is fixed with glass sealing to a stem base plate 1 to which a heat sink 3 is fastened and which is not yet subjected to plating treatment. After removing an oxidated film on the exposed surface of the base plate 1, an electrically plated Ni layer 9 is formed. This forming of the plated layer 9 can be easily conducted by using a racking method with the aid of mounting holes 2 in the base plate 1. Also, since the plating is effected after the glass sealing of the lead wire 5, a thickness of the plated layer is freely determined and the fear of oxidation on the surface is eliminated.

Inventors

• 👤 Junichi Okada

Bibliographic Details