Method and metallic mold for plastic molding

Abstract

Abstract PURPOSE:To improve yield and also to increase number of cavities by a method wherein a molding material is supplied into a plural pots being arranged adjacently to each cavity, pressurized and poured to a cavity side directly from each pot for molding. CONSTITUTION:A lead frame 4 provided with a semiconductor chip is placed on the face of a lower mold body 22 at each cavity block, and a preheated thermosetting resin molding material is supplied into each pot 31. Next, the lead frame 4 is placed accurately in position on a face 3 whereat upper and lower molds 1, 2 come in contact by closing the molds, an oil is fed into each cylinder 30 of an oil mechanism 27 to lift each plunger 36, and the molding material in the pot is pressurized to plasticize with a curl 12. The plasticized molding material is fed in each cavity 11 through a gate 13, and each semiconductor chip is sealed for molding. Next, the molds are opened to release a molding 37 in the cavity 11 of the upper mold from the cavity 11 together with the lead frame 4, thus obtaining desired molding.

Inventors

• 👤 Kazuo Bando

Bibliographic Details