Integrated circuit structure

Abstract

Abstract PURPOSE:To reduce thermal resistance and increase density, by the method wherein a plurality of IC mounting holes are opened on a substrate of heat pipe structure, made of seramic or silicon, hollows that straddle these holes are provided, and wicks provided on the back of the IC are exposed here. CONSTITUTION:Capillary like structure 10, called wick, is formed on the back of IC element 1 by chemical etching or mechanical processing. On the upper part of substrate 9, made of ceramic or silicon, on which element 1 is to be mounted, a required number of holes 16 for mounting element 1 are provided. On the lower part below these holes 16, hollows 13 straddling holes 16 are formed by separating them by supporting rods 12. Next, elements 1 having wires 5 on the surface are inserted into holes 16. They are fixed by using adhesive 15, and a part of wick 10 on the back of elements 1 are exposed inside hollows 13. Subsequently, the top of elements 1 are covered by case 6 having connectors 8. Heat discharge fins 3 are fitted to one end of substrate 9.

Inventors

• 👤 Takaaki Osaki
• 👤 Etsuro Sasaki

Bibliographic Details