Low expansion powder composition for bonding use

Abstract

Abstract PURPOSE: To provide a title compsn. suitable for mutual bonding of parts of silicon nitride and silicon carbide by mixing specific compsn. glass powder with low expansion filler powder such as cordierite, aluminum titanate, and zircon. CONSTITUTION: To provide the object low expansion powder compsn. for bonding use, 10W55wt% of glass powder consisting in wt% of SiO 2 :30W65, Al 2 O 3 :0.5W 25, B 2 O 3 :0.1W25, PbO:0.5W45, CaO:0W20, TiO 2 :0W18, ZnO:0.1W30, MgO:0W 10, BaO:0W10, SrO:0W10, Na 2 O:0W10, Li 2 O:0W10, K 2 O:0W10, Sb 2 O 3 :0W3, As 2 O 3 :0W30, SnO 2 :0W5, and F:0W3 is mixed with 90W45wt% of at least one of low expansion filler powder such as cordierite, β-spodumene, aluminum titanate, zircon. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Keiichiro Suzuki
• 👤 Jiro Chiba

Bibliographic Details