Resin sealing type semiconductor device

Abstract

Abstract PURPOSE: To seal resin in a shape that impurities do not contact with a surface of a chip supported on a substrate, by placing a resin impregnated fiber sheet on the bonding wires of the chip, and by hanging resin by means of heat treatment. CONSTITUTION: A fiber sheet 4 to which resin is impregnated is placed on bonding wires 51, 52 for connecting the electrodes 31, 32 of a semiconductor element chip 2 supported glueing to a substrate 1 and inner leads 41, 42, melted resin 7 is suspended to the inner lead sides from fringe of the sheet by letting the whole pass on a hot plate with approximate 150°C for 10W30sec, and the whole circumference is sealed while the whole body is hardened and solidified. The quantity of resin hung is controlled by the adjustment of the pressure of a roller in the case when resin is impregnated to the fiber sheet. Thus, the contact of the resin with a surface of the chip is eliminated, and products, which reliability is high and which life is long, can be obtained. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kenji Miyajima

Bibliographic Details