Manufacture of semiconductor device

Abstract

Abstract PURPOSE: To prevent the chipping or cracking of a pellet, simplify a mechanism and accelerate the mounting work of the pellet, by directly conveying the pellet to a mounting position and correcting the location of the pellet to the mounting position by positioning claws. CONSTITUTION: A pellet 1 on a tape 2, which is divided from a wafer, is attracted on the tip of a vacuum attraction pen 11 and exfoliated from the tape. The pellet 1 is directly conveyed onto a radiator plate 8 as the pellet is attracted on the pen and moved vertically and horizontally. The pellet 1 is bonded on molten solder 9 in a mounting position. At that time, positioning claws 12 are moved together with the vacuum attraction pen 11 as the claws are open. After the pellet is slid by the pen to be adapted to the molten solder 9, the claws 12 are operated to correct the location of the pellet 1 in four diretions by the claws. The vacuum attraction pen 11 is made of silicone rubber or the like. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Masaru Kosaka

Bibliographic Details