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JPS5572049A Expired / Lapsed JP ⏱️ 0.0 years remaining

Wire bonding device

Assignee: NEC Corp
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Filing: 1978-11-27
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Granted: —
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Expires: 1998-11-27
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Abstract

Abstract PURPOSE: To obtain a stable loop having a constant tension at the bonding, by jetting air to a fed wire from a nozzle. CONSTITUTION: Motion of cam 22 is linked with a mechanism which controls motion of a capillary 3 and the one cycle motion of capillary leads one rotation of shaft 25. When a wire loop is formed, the timing of clampper 18 is adjusted by lever 19 so as the length of a wire fed is always to be larger than the necessary length to make a loop. By this consitution, as the wire 15 becomes always loose under the friction plate unit, a constant tension of the wire is obtained by blowing air from a nozzle 5. The control of tension is achieved by changing the air pressure. When it is tool loose, it contacts a electrode 26 and is controlled so as the clampper 18 dose not close. By so doing, a stable wire loop is obtained and even at the high speed, it is possible to obtain highly reliable bonding. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Yoshiaki Fukui

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 21:05
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07502; H10W72/07521; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756

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