Direct mounting

Abstract

Abstract PURPOSE:To improve mounting precision, by holding a semiconductor pellet attached to a pickup tool of a mounting head by means of gauging arms provided on the outer surface of the tool and thereby positioning it, and mounting it on the adhesive-coated surface of a lead frame. CONSTITUTION:Mounting head 12 having vacuum-suction pickup tool 14, which is placed in the center of base 13 in such a manner that it can move up and down freely, is fitted to the end of rod 11, which can move back and forth in a straight line or move up and down. Gauging arms 16, which are supported by supporting shafts 15 and can rotate freely, are provided on the four sides of base 13. Tool 14 is made to make up-and-down motion by lever 22 which moves up and down about supporting shaft 12. Lower end 16a of arm 16 is opened or closed by positioning cam 28, and fixes up-and-down moving tool 14 for a specified time. By this, pellet 1 is sucked by tool 14, positioning is done by arm 16, and thereby it is placed on lead frame 5.

Inventors

• 👤 Koichi Tamai
• 👤 Masao Tanaka

Bibliographic Details