Manufacture of microwave strip circuit

Abstract

Abstract PURPOSE:To realize manufacture of the strip circuit without using any specific pressing tool by using the conductive adhesive sheet containing a number of holes. CONSTITUTION:Dielectric substrate 3 having strip pattern 4 on the upper surface is mounted onto earth substrate 1. In this case, substrate 3 is piled on conductive adhesive sheet 2 containing holes 5. In such way, numbers of microwave strip circuits are arranged on substrate 1 to form a packaged function circuit 8. Circuit 8 is then put into the pressure container to receive the pressure and heat, thus carrying out bonding between substrata 3 and 1. In this case, some difference is caused between the pressure applied to substrate 3 corresponding to the area of the hole on sheet 2 and the area with no hole drilled. As a result, substrate 3 is pressed strongly onto substrate 1 to be bonded together firmly. In such way, the strip circuit can be manufactured without using any specific pressing tool.

Inventors

• 👤 Norio Yabe

Bibliographic Details