Composite integrated circuit

Abstract

Abstract PURPOSE: To increase bonding strength, by providing a projected dam made of a conductor or dielectic body at the position for fitting a chip on a base at the time of fixing a semiconductor chip on an insulated base and pasting a chip to this with adhesive agent. CONSTITUTION: Conductor 3 is fitted in the center of insulated base 1 corresponding to semiconductor chip 5 to be pasted later. On both sides of this are fited external electrode conductors 2. Next, chip 5 is fixed on conductor 3 by using adhesive 4. At this time, however, dam 9, made of a conductor or dielectric and having a uniform height, is built at the end part of conductor 3 so as to surround adhesive 4. Subsequently, chip 5 is fixed by means of adhesive 4, and two bonding pads 6 provided on chip 5 are respectively bonded to conductors 2 by means of wire 7. By this, no deterioration occurs in the strength of wire tension, nor deviation appears. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kazuo Ikeda

Bibliographic Details