Gold plated electronic parts and production thereof

Abstract

Abstract PURPOSE:To produce captioned electronic parts of high quality even with thin gold- plated layer, by applying alloy-plating on the metal surface as the base coat for gold- plating, while adding replenishing solution containing specified Ni/Co ratio into alloy-plating solution containing Ni and Co. CONSTITUTION:When alloy-plating is applied to the metal surface by using alloy- plating solution containing Ni and Co, since Co deposits faster than Ni, a replenishing solution having a smaller Ni/Co ratio than the Ni/Co ratio in the plating solution is being added in the cource of alloy-plating. As a result, alloy-plating with stable quality may be obtained. It is preferable to keep the thickness of this alloy-plating layer within 0.1-10mu, and the Co content in the alloy within 2-60wt%. In this method, even if the thickness of gold-plating, which is usually 2-4mu, is made as thin as 1-2mu, the same performance may be obtained.

Inventors

• 👤 Terukichi Nagashima
• 👤 Akio Takami
• 👤 Akiyo Kasugai

Bibliographic Details