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JPS5527615A
Expired / Lapsed
JP
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Clad material for ic package
Assignee: DAIDO KAKO KK
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Filing: 1978-08-17
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Granted: —
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Expires: 1998-08-17
Abstract
Abstract PURPOSE:To eliminate purple plague in Al fine wire joint and improve water resistance and airtightness in IC package sealing, by pressure-fitting Al-Si alloy thin plate and Au-Ge alloy thin plate on both sides of Ni or Ni-containing alloy base material. CONSTITUTION:Clad base material 31 consists of Ni or iron alloy containing Ni, such as Kovar. Layer 32, which is fitted on its one side, is made of Al or Al-Si alloy. Layer 33, which is fitted on its other side, is made of Au-Ge alloy. For Al-Si alloy, Si comprises 0-5wt%. For Au-Ge alloy, Ge comprises 6-12wt%.
Inventors
- 👤 Akira Kuwano
- 👤 Kyoji Moriyama
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 22:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/20; H10W70/24; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/753
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