Patent JPS55107237A successfully refreshed from Google Patents.
← Back to Patent Explorer
JPS55107237A Expired / Lapsed JP ⏱️ 0.0 years remaining

Resin molding method and device

Assignee: Hitachi Ltd
•
Filing: 1979-02-09
•
Granted: —
•
Expires: 1999-02-09
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE: To improve the utilization efficiency of a material by crushing a flowpath filled with a resin in the final stage of the resin pressure forming operation to forcibly press the resin within the flowpath. CONSTITUTION: A work 38 is placed on a lower mold 24 and mold-clamped. Thereafter, resin tablets are supplied from the cylinder part of a upper mold 25 to cause a plunger 33 to descend. A resin 40 in a softened molten state is pressed and flows into a mold space 42 through a flowpath 41. The resin tablets are adjusted so that a remaining space 43 exists in a mold space 42 when the plunger 33 has completely descended. Then, when a plunger 34 is caused to descend and a plate 35 infiltrates in a flowpath 41, a resin 40 is extruded to fill the remaining space 43 therewith. After thermosetting the resin, the mold is opened, and a molded product 44 and an unnessary resin mass 45 are taken out. According to this organization, generation of unfilled resin powders and that of pinholes or voids can be prevented. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Isao Araki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 22:23
CPC Classifications
—

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag