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JPS547868A Expired / Lapsed JP ⏱️ 0.0 years remaining

Manufacture for beam lead type semiconductor device

Assignee: NEC Corp
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Filing: 1977-06-20
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Granted: —
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Expires: 1997-06-20
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Abstract

Abstract PURPOSE: To increase the working efficiency, by sticking the substrate element to the fixed substrate, performing mechanical or chemical etching depending on the display of substrate back surface, and picking up selectively with bonding tool. COPYRIGHT: (C)1979,JPO&Japio

Inventors

  • 👤 Masaru Nakamura

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-03 10:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07251; H10W72/20

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