JPS547868A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture for beam lead type semiconductor device
Assignee: NEC Corp
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Filing: 1977-06-20
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Granted: —
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Expires: 1997-06-20
Abstract
Abstract PURPOSE: To increase the working efficiency, by sticking the substrate element to the fixed substrate, performing mechanical or chemical etching depending on the display of substrate back surface, and picking up selectively with bonding tool. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 00:07
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07251; H10W72/20
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