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JPS546459A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor device

Assignee: Hitachi Ltd
•
Filing: 1977-06-17
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Granted: —
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Expires: 1997-06-17
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Abstract

Abstract PURPOSE: To maintain a surface contact with a lead at the center part, by constituting a bump electrode with the center part protruded from the circumferential part. COPYRIGHT: (C)1979,JPO&Japio

Inventors

  • 👤 Isao Sakamoto
  • 👤 Akihiro Tomosawa

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 22:11
CPC Classifications
—

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