Curable resin composition

Abstract

Abstract PURPOSE: A resin composition curable by light irradiation and capable of forming a film having improved impact resistance and adhesiveness, consisting of a prepolymer or a monomer having an unsaturated double bond, a photopolymerization initiator, and a butadiene-containing polymer. CONSTITUTION: A resin composition consistng of A) preferably 5W70 wt.% of a prepolymer or a monomer having an nusaturated double bond, B) preferably 0.01W10 wt.% of a photopolymerization initiator, and (C) polybutadiene having a molecular weight of 500W20,000, preferably 600W10,000 or a butadiene copolymer consisting of 50wt.% or more of butadiene. If the molecular weight of the polybutadiene or the butadiene copolymer is not more than 500, the curability of the composition drops and a curing time increases. A molecular weight of the polymer or the copolymer not less than 20,000 causes an extraordinary rise in viscosity, which lowers operation efficiency COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Ryozo Konno
• 👤 Akira Ikeda
• 👤 Susumu Tsuchiko
• 👤 Takahiko Yamaso

Bibliographic Details