Patent JPS542243A successfully refreshed from Google Patents.
JPS542243A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Ultrasonic wave soldering apparatus
Assignee: AGC Inc
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Filing: 1977-06-09
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Granted: —
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Expires: 1997-06-09
Abstract
Abstract PURPOSE:To solder only metal surface of substance, exposing nonmetal and metal on the surface without using flux, by dipping in jet stream solder bath given ultrasonic vibration, in nonoxidizing atmosphere.
Inventors
- 👤 Koji Nomaki
- 👤 Toru Iseda
- 👤 Keiji Kishi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-31 15:56
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0661
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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