Patent DE567758C successfully refreshed from Google Patents.
Patent JPS5386572A successfully refreshed from Google Patents.
JPS5386572A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor integrated circuit
Assignee: Seiko Epson Corp
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Filing: 1977-01-10
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Granted: —
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Expires: 1997-01-10
Abstract
Abstract PURPOSE: To obtain a face-down IC at low cost and a high yield by forming a solder thin-film layer on the aluminum thin-film of bonding pads and using low melting point alloy basically composed of Pb, Sn, etc. as solder. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Koichi Oguchi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 16:04
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
JPS5111565A
Cited
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