Patent JPS5366172A successfully refreshed from Google Patents.
JPS5366172A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Resin mold element
Assignee: Hitachi Ltd
•
Filing: 1976-11-26
•
Granted: —
•
Expires: 1996-11-26
Abstract
Abstract PURPOSE: To prevent fatigue disconnection of wire by controlling sealing resin so that a junction wire may not exist on the boundary face of chip covering resin. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Akira Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 21:59
CPC Classifications
—
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.