Patent JPS5363979A successfully refreshed from Google Patents.
JPS5363979A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Sealing method of semiconductor element and lead frame used for the same
Assignee: Hitachi Ltd
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Filing: 1976-11-19
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Granted: —
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Expires: 1996-11-19
Abstract
Abstract PURPOSE: To obtain resin sealing of high moisture resistance by using a lead frame of the structure in which electrode lead-out leads and semiconductor support parts are not connected to outer frames and are supported only at dam parts. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Kunihiro Tsubosaki
- 👤 Kunihiko Nishi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-26 21:03
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
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