Patent JPS5339873A successfully refreshed from Google Patents.
JPS5339873A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Etching method of silicon semiconductor substrate containing gold
Assignee: Hitachi Ltd
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Filing: 1976-09-24
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Granted: —
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Expires: 1996-09-24
Abstract
Abstract PURPOSE: To make a flat surface by etching a wafer with a solution mainly composed of hydrofluoric acid, nitric acid and hydrochloric acid, and simultaneously etching the gold and gold-Si eutective alloy within the wafer. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Yukio Murayama
- 👤 Hiroshi Yokoyama
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-10 00:53
CPC Classifications
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