Patent JPS5339067A successfully refreshed from Google Patents.
JPS5339067A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Production of semiconductor device
Assignee: Hitachi Ltd
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Filing: 1976-09-22
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Granted: —
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Expires: 1996-09-22
Abstract
Abstract PURPOSE: To save connecting operation for heat sink and lead frame, reduce the number of steps and facilitate locating of semiconductor pellets by integrating the heat sink and lead frame through fabrication of a specially shaped metal material plate. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Susumu Okikawa
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 16:11
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
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