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JPS5230185A Expired / Lapsed JP ⏱️ 0.0 years remaining

Process for producing semiconductor device

Assignee: Hitachi Ltd
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Filing: 1975-09-03
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Granted: —
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Expires: 1995-09-03
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Abstract

Abstract PURPOSE: To provide a semiconductor integrated circuit device having a high pressure resistance, wherein the isolation zone and parasitics effects are minimized by forming the insulation layer through ion implanting method and by using the anisotropic etching. COPYRIGHT: (C)1977,JPO&Japio

Inventors

  • 👤 Toru Inaba

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 01:46
CPC Classifications
—

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