Patent JPS51116998A successfully refreshed from Google Patents.
JPS51116998A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor resin composition
Assignee: DIC Corp
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Filing: 1975-04-08
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Granted: —
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Expires: 1995-04-08
Abstract
Abstract PURPOSE: A flexible semiconductor resin composition having excellent heat-proof and oil-proof property, composed of conductive carbon black and ethylenevinyl acetate copolymer. COPYRIGHT: (C)1976,JPO&Japio
Inventors
- 👤 Takuji Hirose
- 👤 Muneo Koyama
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 02:43
CPC Classifications
—
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
JPS4827111A
Cited
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