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JPH0964029A Expired / Lapsed JP ⏱️ 0.0 years remaining

Deposition method

Assignee: Semiconductor Process Laboratory Co Ltd
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Filing: 1995-08-18
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Granted: —
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Expires: 2015-08-18
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Abstract

Abstract Translated from Japanese (57)【要約】 【課題】熱CVD法によるフッ素含有シリコン酸化膜の 成膜方法に関し、カバレージに優れ、比誘電率が小さ く、膜質の安定なフッ素含有シリコン酸化膜を形成す る。 【解決手段】基板6を加熱した状態でSi−F結合を有 する有機シランとSi−F結合を有しない有機シランと 酸化性ガスとを含む混合ガスを反応させて基板6上にフ ッ素含有シリコン酸化膜を形成する。 The present invention relates to a method for forming a fluorine-containing silicon oxide film by a thermal CVD method, which forms a fluorine-containing silicon oxide film having excellent coverage, a small relative dielectric constant, and stable film quality. SOLUTION: A fluorine-containing silicon oxide is oxidized on the substrate 6 by reacting a mixed gas containing an organic silane having a Si-F bond, an organic silane having no Si-F bond and an oxidizing gas in a state where the substrate 6 is heated. Form a film.

Inventors

  • 👤 Kazuo Maeda
  • 👤 和夫 前田
  • 👤 Toku Tokumasu
  • 👤 徳 徳増
  • 👤 Yoshiaki Yuyama
  • 👤 芳章 湯山

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 19:58
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6924; C; C23; C23C; C23C16/00; C23C16/22; C23C16/30; C23C16/40; C23C16/401; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/65; H10P14/6516; H10P14/6529; H10P14/6532; H10P14/6336; H10P14/66; H10P14/668; H10P14/6681; H10P14/6682; H10P14/6684; H10P14/6686; H10P14/69215

Claims Analysis

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References Cited (Backward Citations)

JPH04167431A Cited
JPH0750295A Cited
JPH07161705A Cited
JPH07211712A Cited

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