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JPH0855752A Expired / Lapsed JP ⏱️ 0.0 years remaining

Mounting method of multilayer capacitor and multilayer capacitor

Assignee: Taiyo Yuden Co Ltd
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Filing: 1994-08-10
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Granted: —
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Expires: 2014-08-10
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Abstract

Abstract PURPOSE:To provide a method for mounting a layered capacitor by which the volume of squeaking sounds can be reduced when a voltage is applied across the capacitor. CONSTITUTION:Since a layered capacitor l in which internal electrodes 3 are faced to each other in a chip 2 is mounted on a substrate Z so that the surfaces of the electrodes 3 cannot become parallel to the surface of the substrate Z, the vibration of the electrodes 3 is not transmitted directly to the substrate Z even when the electrodes 3 vibrate in the facing direction of the electrodes 3 when a voltage is applied across the electrodes 3 and the amount of squeaking sounds can be reduced by suppressing the transmission of the vibrations to the substrate Z.

Inventors

  • 👤 Masakazu Koga
  • 👤 昌和 古賀
  • 👤 Shunji Murai
  • 👤 俊二 村井
  • 👤 Osamu Fujii
  • 👤 理 藤井
  • 👤 Sadaaki Kurata
  • 👤 定明 倉田
  • 👤 Shinichi Ishida
  • 👤 晋一 石田
  • 👤 Minoru Takahashi
  • 👤 実 高橋

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 00:49
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/181

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