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Method and apparatus for plasma treatment

Assignee: Panasonic Electric Works Co Ltd
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Filing: 1992-06-19
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Granted: —
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Expires: 2012-06-19
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Abstract

Abstract Translated from Japanese (57)【要約】 【目的】 プラズマ処理方法において、低圧雰囲気の形 成・制御用の装備が不要であり、処理の不均一が解消で き、適切な大面積処理と製造コストの低減が実現できる 改善策を提供する。 【構成】 この発明では、対向して設置された一対の電 極2,3の間に大気圧付近の圧力下で生起させられたプ ラズマであって、電極の少なくとも一方の電極の他方の 電極に臨む面に開口した通気孔16・・からのガス導入 を伴うプラズマにより、被処理物の表面を処理するにあ たり、通気孔が開口する面の上に多孔質体20を設けて おいて、通気孔からのガスが多孔質体を通ってプラズマ に入るようにしたことを特徴とする。 (57) [Abstract] [Purpose] Improvement that does not require equipment for forming and controlling low-pressure atmosphere in plasma processing method, can eliminate non-uniformity of processing, realize appropriate large area processing and reduce manufacturing cost. Provide a solution. According to the present invention, plasma generated between a pair of electrodes 2 and 3 facing each other under a pressure near atmospheric pressure is exposed to at least one of the electrodes and the other electrode. When treating the surface of the object to be treated with plasma accompanied by gas introduction from the vent holes 16 ... Opened on the surface, the porous body 20 is provided on the surface where the vent holes are opened, This gas is characterized in that it enters the plasma through the porous body.

Inventors

  • 👤 Meiji Goto
  • 👤 明治 後藤
  • 👤 Koji Sawada
  • 👤 康志 澤田
  • 👤 Sachiko Okazaki
  • 👤 幸子 岡崎
  • 👤 Masuhiro Kokoma
  • 👤 益弘 小駒

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 07:41
CPC Classifications
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