Profiling method of printed-wiring board

Abstract

Abstract PURPOSE:To eliminate the generation of burrs on the cut ends by a method wherein the profiling work of a printed-wiring board is performed in such a way that the plated lead parts are always cut by the part of the new blade of a diamond cutter. CONSTITUTION:When a printed-wiring board is made by a method, wherein through- holes are drilled through an insulating plate, an electroless copper plating is applied to form through holes and thereafter, patterns are respectively formed on both surfaces of the plate, then, a solder resist is appied, then, after a masking for partial plating use is put on leads, a partial plating of a nickel-gold plating is applied to the leads and the masking is peeled, the partially plated leads on both surfaces of the wiring board are previously coupled with each other through the through holes and the partially plated leads on one surface of the wiring-board are eliminated. The partially plated lead parts on the other ' surface of the printed-wiring board are faced to the lower side, the Z-axis of an NC router is lowered each time a constant distance is cut using an up-cutter of a diamond cutter to lower automatically the diamond cutter, the plated lead parts are always cut by the part of a new blade and profiling work of the wiring board is performed. Thereby, burrs are not generated on the cut ends of the plated leads and the plated leads can be prevented from being peeled.

Inventors

• 👤 Shigeaki Sato
• 👤 佐藤　茂明

Bibliographic Details