Patent JPH0452276A successfully refreshed from Google Patents.
← Back to Patent Explorer
JPH0452276A Expired / Lapsed JP ⏱️ 0.0 years remaining

Ion sputtering device and method

Assignee: Hitachi Naka Seiki Ltd
•
Filing: 1990-06-20
•
Granted: —
•
Expires: 2010-06-20
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE:To improve the efficiency of sputtering by providing a power source for forming a glow discharge which can independently control the impressed voltage for each of plural target metals. CONSTITUTION:The thin film consisting of the mixture composed of the plural target metals 11, 12 is formed on the surface of a sample 5 by the glow discharge between the plural target metals 11, 12 and single sample 5, such as semiconductor wafer, in a vacuum chamber 20. The power source 61 for forming the glow discharge is, thereupon, so provided that the impressed voltage for each of the plural target metals 11, 12 can be controlled independently from each other. The compsn. ratios of the formed thin film are varied in the thickness direction in this way and the thin films varying in the compsn. ratios are freely laminated.

Inventors

  • 👤 Koichi Miyazawa
  • 👤 宏一 宮澤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 09:50
CPC Classifications
—

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag