Semiconductor device and its manufacture

Abstract

Abstract PURPOSE:To obtain a semiconductor device which is provided with functions which can not be formed on a chip and is low is cost and stable in its quolity by a method wherein a joint chip constituted of the following is installed between the chip and a lead frame: a conductor part constituting a circuit; a functional element; an external electrode; an internal electrode; and the like. CONSTITUTION:An adhesive 3 is sealed a little in a chip-fixing hole 2 in an under cover 1; in the same manner, an adhesive 11 is sealed in holding holes 12 in a side cover 7. A chip 4 is inserted in the chip-fixing hole 2 in the under cover 1; a lead frame 6 is put from the upper part; the side cover 7 is put from the upper part; the lead frame 6 is fixed. In this state, a joint chip 8 is mounted on the chip 4 and the lead frame 6 through a penetration part 15 in the side cover 7; in addition, an upper cover 9 is combined and brought into close contact from the upper part; a heat treatment is executed; the lead frame 6 and the chip 4 are mounted strongly. A resistance, a capacitor, a diode, a transistor and the like are incorporated in the joint chip 8.

Inventors

• 👤 Yasuhiro Morita
• 👤 森田　康博

Bibliographic Details