Manufacture of chip type fuse

Abstract

Abstract PURPOSE:To form conductor circuits and electrodes in the same process, and also to improve the adhesive strength of each of the electrodes to a substrate and the fusing characteristic of each of chip type fuses without causing the corrosion or the like thereof by making use of a Cu film formed through a process of plating with a photo-etching process to compose the conductor circuits and the electrodes respectively. CONSTITUTION:The surface of a ceramic substrate 2 formed collectively with plural chip-type fuses is roughened to form a Cu film in a thickness of 2 to 10mum through a process of electroless plating. A resist film is formed on the top face of the Cu film to be exposed, developed, etched and peeled respectively so as to leave only the required part of the Cu film and form each of conductor circuits 3 and each of electrodes 4, and subsequently a silicone film 9 is formed on the top face of the conductor circuit and the top exposed face of the ceramic substrate respectively. Ni plating 7 and Au plating 8 are given to the top face of the electrode 4, and subsequently the substrate 2 is divided into separate parts to be each formed in a chip shape. The electrodes and the conductor circuits can be formed each in the same process to be suited for the mass production of a chip type fuse.

Inventors

• 👤 Yukihisa Hiroyama
• 👤 幸久 廣山
• 👤 Masayoshi Ikeda
• 👤 正義 池田
• 👤 Tokio Isogai
• 👤 磯貝　時男
• 👤 Tetsuya Takahashi
• 👤 徹也 高橋
• 👤 Seiji Mimori
• 👤 三森　誠司

Bibliographic Details