Wafer dicing device

Abstract

Abstract PURPOSE:To enhance the capability of a device by mounting two dicing blades and aligning the central line of the two blades during the dicing operation with the same straight line. CONSTITUTION:Two blades 1 and 2 are aligned with a dicing central line 3 on the same straight line. When actual dicing is carried out, a wafer is half-cut diced with the first blade 1 in down cut mode and full-cut diced with the second blade 2. These two dicing operations are carried out without interruption. The bottom of a groove widely pre-diced with the first blade 1 is further diced with the second blade 2, which reduces the thickness of the wafer to be diced with the second blade 2 extremely. This construction makes it possible to extend the lifetime of the blades, reduce billet dimensions and enhance dicing capability as well.

Inventors

• 👤 Mamoru Kajiwara
• 👤 梶原　護

Bibliographic Details