Semiconductor package

Abstract

Abstract PURPOSE:To obtain a semiconductor package able to prevent formation of a resin burr due to seeping of sealing resin in a resin sealing process by providing a ring-shaped projection around the part, in which the rear of a metal cap is expected to be exposed after resin sealing. CONSTITUTION:In a semiconductor package shown in the title, after a tape carrier is manufactured by connecting a semiconductor element 1 to a carrier tape, the semiconductor element 1 is put on a metal cap 9 through a stem 10 followed by resin sealing by using a metal mold. 14 is a projection formed ring-shapedly on a part where no semiconductor element 1 of the metal cap 9 is put on, and the height of the projection 14 is in the range of scores of microns to 0.5mm. From the above, the ring-shaped projection 14 sticks to a lower metal mold at the time of resin sealing so as to prevent sealing resin 12 from seeping.

Inventors

• 👤 Tetsuya Ueda
• 👤 哲也 上田

Bibliographic Details