Lead frame for integrated circuit

Abstract

Abstract PURPOSE:To fix an IC chip to lead frames without any junction by die bonding process by a method wherein the title lead frame is provided with a die pad part mounting the IC chip as well as a holder part holding the sides of the IC chip by spring tension at least in two directions. CONSTITUTION:It is recommended that a holder part 5 is formed in leaf spring type while the shape, dimension and thrusting pressure thereof avoid the slip and destruction of an IC chip in the later process. The IC chip 4 is mounted on a die pad part 1 while the four sides of the IC chip 4 are held by the spring tension of the holder part 5 and then lead parts 2 and the IC chip 4 are connected by connecting wires 6. During the processes, the junction by die-bonding process can be avoided thereby enabling the junction of IC chip 4 and the heating in the junction process causing thermal strain to be avoided. Furthermore, since the junction of the IC chip 4 and the lead frame parts 2 by die- bonding process is avoided, the die-bonding process can be eliminated from the package assembling process of integrated circuit.

Inventors

• 👤 Kenji Kubozono
• 👤 久保薗　健治
• 👤 Hisatoshi Ito
• 👤 久敏 伊藤
• 👤 Toshihiko Mori
• 👤 俊彦 森
• 👤 Toshihiro Kurita
• 👤 栗田　敏広

Bibliographic Details