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JPH039554A Expired / Lapsed JP ⏱️ 0.0 years remaining

Lead frame

Assignee: Shinko Electric Industries Co Ltd
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Filing: 1989-06-07
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Granted: —
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Expires: 2009-06-07
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Abstract

Abstract PURPOSE:To prevent the deformation of an inner lead due to injection of mold resin by a method wherein tapes in shapes with simple reinforcement parts are stuck to the inner lead and a terminal at easily deformable parts. CONSTITUTION:A support bar 1b holding a die stage 1a of a lead frame 1 is connected to an outer frame 1f; a terminal 1c is provided to the intermediate part of the support bar 1b; while the terminal 1c and the inner lead 1d provided between the terminal 1c and the inner lead 1d are taped up with one another to avoid the deformation of the lead 1d. The shapes of these tapes are differentiated from one another by the taped up positions while the injection part of mold resin is provided on a metallic mold. On the other hand, tapes 2c, 2d at the distant parts on the opposite side of the injection part of the injected and easily set mold resin are stuck to the positions as near as possible to the end part of the inner lead 1d. Through these procedures, the deformation of the end part of the inner lead 1d can be prevented.

Inventors

  • 👤 Tsuyoshi Aoki
  • 👤 強 青木
  • 👤 Eiji Yokota
  • 👤 横田 栄二
  • 👤 Takashi Mizusawa
  • 👤 水澤 隆志

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 16:11
CPC Classifications
—

Claims Analysis

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References Cited (Backward Citations)

JPH01106461A Cited

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