Mounting structure of flip chip element

Abstract

Abstract PURPOSE:To erect the title mounting structure capable of accurately making alignment of an element within a short time while acquiring such merits as the reduction of manufacturing cost, the enhancement of reliability upon the mounting of flip chip element, etc., by a method wherein a sheet type thermal stress relaxing member making bump regulating holes having the thermal resistance and the electrical insulating properties is arranged on a circuit pattern on an insulating substrate. CONSTITUTION:Within the title mounting structure of a flip chip element 7 to be electrically connected by welding bumps 10 provided on the flip chip element 7 into a circuit pattern 9 formed on an insulating substrate 6, a sheet type thermal stress relaxing member 8 having thermal resistance and electrical insulating properties is arranged on the circuit pattern 9 on the insulating substrate 6 while bump regulating holes 11 to avoid the outflow of the bumps 10 fused with the guide of the said bumps 10 are made in the thermal stress relaxing member 8. For example, tapered bump regulating holes 11 are made in the patterns corresponding to the bumps 10 on the said thermal stress relaxing member 8 while register marks 12 are made on the four corners to be aligned with respective corner parts of the flip chip element 7 so that the said element 7 may be aligned with the circuit pattern 9.

Inventors

• 👤 Koichi Murakoshi
• 👤 村越　孝一
• 👤 Junichi Kanazawa
• 👤 金沢　淳一

Bibliographic Details