Semiconductor device and its manufacture

Abstract

Abstract PURPOSE:To absorb the warp of a semiconductor pellet itself caused by heat and the warp generated at the time of contraction of a package, by arranging a plate type body whose young's modulus is smaller than that of adhesive agent at the time of hardening, on the base substrate of a part where the semiconductor pellet is fixed, and spreading the sdhesive agent on the plate type body to fix the semiconductor pellet. CONSTITUTION:A plate type body whose Young's modulus is smaller than that of hardened Ag paste is used. For example, a low elasticity tape 9 made of polyimide is flatly arranged on the main surface of a tab 7 so as to be smaller than the tab 7. A semiconductor pellet 6 is fixed with the Ag paste 10 by using the tab 7 made of metal and the low elasticity tape 9 as the cushion. By this constitution, the warp of the semiconductor pellet caused by heat, the warp of the tab, and the stress applied to the pellet by the contraction of the package can be absorbed, and at the same time, the flatness of the semiconductor pellet can be very easily controlled.

Inventors

• 👤 Isao Sasahara
• 👤 笹原　功

Bibliographic Details