Substrate treating device

Abstract

Abstract PURPOSE:To enable a uniform development treatment to be made over the entire surface of a wafer by placing a plurality of nozzles for supplying chemical from the outer-periphery direction of a wafer toward the central direction on the concentric circle and in ring shape at the outside. CONSTITUTION:A chuck 2 provided within a cup 4 fixes a wafer 3 by vacuum adsorption and rotates the wafer 3 from low speed to a high speed (for example, 20-6000rpm) sequentially. A plurality of chemical nozzles 7-14 are attached to a nozzle fixing ring 6 which is on the concentric circle with the outer periphery of the wafer 3 and is placed at the outside, thus constituting a ring-shaped chemical supply part, while a chemical nozzle 1 is attached to the central upper position of the wafer 3. The chemical nozzles 7-14 can supply chemical liquid from the outer-periphery direction of the wafer 3 toward the central direction. Also, the chemical nozzle 1 supplies chemical toward the center of the wafer 3. Development liquid is supplied from the chemical nozzle 1 which is fixed toward the center of the wafer 3 onto the wafer 3. At the same time, developer is also supplied from the outer periphery part of the wafer 3 by the chemical nozzles 7-14 which are placed in ring shape at the outer periphery part of the wafer 3.

Inventors

• 👤 Takeshi Wakahara
• 👤 健 若原

Bibliographic Details