Formation of overlay plating on electronic component mounting board

Abstract

Abstract PURPOSE:To simplify the process and reduce the quantity of noble metal used for plating by forming a plating-resistant insulating film layer on insulating-base- material-side conductor circuits and forming overlay plating on parts, which are exposed from under the organic insulating film layer, of the conductor circuits with a lead frame used as a plating lead for feeding. CONSTITUTION:The inner ends 11a of a lead frame 11 sandwiched between insulating base materials 12 and conductor circuits 13 on said insulating base materials 12 are electrically connected with through-holes 14 made in the lead frame 11 and insulating base materials 12. A plating-resistant insulating film layer 15 is formed on the conductor circuits 13 on the side of the insulating base materials 12 and only parts, which must be plated by overlay plating 16, of the conductor circuits 13 are exposed. Said parts of the conductor circuits 13 exposed from under the organic insulating film layer 15 are plated by the overlay plating 16 with the lead frame 11 used as a plating lead for feeding. Thereby the required overlay plating 16 can be formed with the minimum of required noble metal.

Inventors

• 👤 Hirotaka Naito
• 👤 内藤　宏孝
• 👤 Atsushi Hiroi
• 👤 廣井　厚
• 👤 Takeshi Takeyama
• 👤 武山　武

Bibliographic Details