Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To take measures to prevent dust particles from being produced by means of a simple method and in a short time and to enhance a productivity by a method wherein, after an insulating film or a conductive film on a substrate has been etched or after an insulating film or a conductive film on a substrate has been formed inside a chamber provided with an adhesion-preventive sheet, a coating film whose close contact property is good is formed on the insulating film or the conductive film which has adhered to the adhesion- preventive sheet. CONSTITUTION:After an insulating film or a conductive film on a substrate 6 has been etched, or after an insulating film or a conductive film has been formed on a substrate 6, particles which are the same as particles of the etched film or particles of the formed film adhere to the surface of an adhesion-preventive sheet 5; a film composed of the particles is formed on the adhesion-preventive sheet 5. However, since a coating film 8 whose close contact property with the film is good is formed on the film, the film which has adhered to the adhesion-preventive sheet 5 is covered with and fixed to the coating film 8. As a result, it is possible to restrain the film adhered to the adhesion-preventive sheet 5 from being exfoliated; it is possible to prevent dust particles from being produced from the adhesion-preventive sheet 5. Thereby, it is possible to take measures to prevent the dust particles from being produced by means of a simples method and in a short time.

Inventors

• 👤 Norihiro Kabei
• 👤 壁井　則広

Bibliographic Details