Cooling device for integrated circuit

Abstract

Abstract PURPOSE:To make it possible to follow freely the relative displacements in all directions between integrated circuits and a heat sink by a plurality of second thermal conductors consisting of a plurality of tabular fins to mesh with the fins of first thermal Conductors by a method wherein the second thermal conductors are arranged between a plurality of pairs of the first thermal conductors consisting of a plurality of fins. CONSTITUTION:Heat generated in each integrated circuit 25 is transmitted to the bottom of a base 2a of a first thermal Conductor 2 on the side of the Circuit 25 and thereafter, is transmitted in order to fins 2b, fins 5b and 5c of second thermal conductors 5, fins 3b of a first thermal conductor 3 on the side of a heat sink 26, a base 3a and a cap 28 and is cooled by a cooler 30. In this case, the displacement in a direction X among the relative displacements between the circuits 25 and the sink 26 is absorbed between the first and second conductors 2 and 5 on the side of the circuits 25, the displacement in a direction Y is absorbed between the first and second conductors 3 and 5 on the side of the sink 26 and the displacement in a direction Z is absorbed between a pair of the first thermal conductors 2 and 3 and the second thermal conductors 5.

Inventors

• 👤 Takahiro Oguro
• 👤 崇弘 大黒

Bibliographic Details