Lead frame and semiconductor device

Abstract

Abstract PURPOSE:To prevent troubles that a bonding wire is separated off from a metal plane or disconnected by a method wherein a through-hole is provided to both sides or either side of the bonding region of the metal plane. CONSTITUTION:In a multilayered lead frame, through-holes are provided around a stage 22 of a grounding plate 14 and to both the sides which sandwich a wire bonding region 14a provided to a power supply plane 12 between them. That is, the through-holes 24 are provided surrounding the stage 22 and on both the sides of the bonding region 14a formed as wide as an inner lead 10. Therefore, when a semiconductor device of this design is sealed up with resin, the through-holes 24 are filled with resin to firmly join the wire bonding region 14a and the sealing resin together. By this setup, a bonding wire is prevented from being separated off or broken.

Inventors

• 👤 Mitsuharu Shimizu
• 👤 清水　満晴
• 👤 Yoshiki Takeda
• 👤 武田　吉樹
• 👤 Hirofumi Fujii
• 👤 藤井　浩文

Bibliographic Details