Semiconductor cooling device

Abstract

Abstract PURPOSE:To enable a cooling device to be improved in cooling power and easily assembled or disassembled and to surely trap a cooling fluid inside it by a method wherein a heat sink is fixed to a semiconductor device, a base which is long in an axial direction is provided to the heat sink, and the side face of the base is connected to a cooling fluid feed header with a an O-ring. CONSTITUTION:Heat released from a semiconductor device 3 is conducted to a heat sink 4 through the intermediary of a solder layer 5. The heat sink 4 is connected to a header 7 with a base 6 and an O-ring 9, and heat transferred to the heat sink 4 is removed by fluid which is made to flow into the heat sink 4 through a nozzle 10. The fluid flowing out of the heat sink 4 is made to flow into the lower jacket of the header 7 of a double structure and discharged outside of the header 7. The trapping of the cooling fluid is made through the O-ring 9 between the side face of the heat sink base 6 and the side of a header opening 8. By this setup, a cooling device of this design can be improved n cooling capacity and easily assembled or disassembled and a cooling fluid can surely be trapped.

Inventors

• 👤 Noriyuki Ashiwake
• 👤 芦分　範行
• 👤 Takahiro Oguro
• 👤 崇弘 大黒
• 👤 Shizuo Zushi
• 👤 頭士　鎮夫

Bibliographic Details