Semiconductor package and mounting board thereof

Abstract

Abstract PURPOSE:To enable a semiconductor package to be easily and surely aligned at mounting and prevented from deviating in position due to vibration at transfer by a method wherein protrusions or recesses used for positioning the semiconductor package to mounting board are provided to the face of the package which confronts the mounting board when it is mounted. CONSTITUTION:Recesses 21 in which prism-like protrusions 11 provided to a semiconductor package 1 are housed are provided to a printed board 2. That is, when the semiconductor package 1 is mounted on the printed board 2, the alignment of the package 1 with the board 2 is carried out by inserting the protrusions 11 provided to the rear of the semiconductor package 1 into the recesses 21 provided to the printed board 2. Moreover, as the protrusions 11 provided to the rear of the semiconductor package 1 are inserted into the recesses 21 of the printed board 2, the semiconductor package 1 is firmly fixed to the printed board 2. By this setup, a semiconductor package can easily and surely be aligned at mounting and prevented from deviating in position due to vibration at transfer.

Inventors

• 👤 Hiroshi Tobimatsu
• 👤 博 飛松
• 👤 Yoshihiko Nemoto
• 👤 義彦 根本

Bibliographic Details