Square plate type chip resistor

Abstract

Abstract PURPOSE:To make it possible to reduce the recesses and projections on the surface of glass, and to achieve highly precise mounting by a method wherein a thick ruthenium film resistance layer, which is overlapped on a part of the upper surface electrode layers on a thick silver film, and a precoat glass layer, having the length less than the space between the upper surface electrodes to be formed on the resistance layer, are provided. CONSTITUTION:The title chip resistor is composed of a 96-alumina substrate 1, the upper electrode layers 2 and 2, and the edge-face electrode layer 3 of thick silver film electrode, a resistance layer 4 of thick ruthenium film, a precoat glass layer 5 covering the length less than the space between the two upper electrode layers 2 and 2 on the above-mentioned resistance layer 4, a first glass layer 6, a marking glass layer 7, and a second glass layer 8. The recesses and protrusions on the surface of glass can be made small and high mounting preciseness can be achieved by forming a glass layer 5, on the recessed part of the resistance layer, of almost the same height as the protuberance of the part, where the upper electrode layer 2 and the resistance layer 4, generating on the end part of the glass surface in the conventional square plate type chip resistor.

Inventors

• 👤 Masato Hashimoto
• 👤 正人 橋本
• 👤 Shigeto Matsumori
• 👤 松森　茂人
• 👤 Junji Matsui
• 👤 松井　純治
• 👤 Jun Nakamoto
• 👤 中元　順

Bibliographic Details