Fitting structure for chip type noise filter

Abstract

Abstract PURPOSE:To obtain the filter fitting method which can display characteristics sufficiently by connecting signal conductor paths to signal electrodes at both ends of the noise filter through connection paths and connecting the ground electrode in the center of the filter to ground conductors. CONSTITUTION:Signal conductor paths 3a and 3b are arrayed and arranged on the top surface of a substrate 1 on the right and left sides of the ground conductors 2a-2c and 2c opposite in parallel. The conductor 2c forms a bridge between the conductors 2a and 2b for the connection of three-terminal capacity 10 with an electrode C. Insulating layers 4a and 4b are provided on the conductor 2c while a gap 5 is left, and the gap 5 serves as an ground electrode connection part for the capacity 10. Then opposite connector paths 6a and 6b are extended to the connection position between signal electrode A and B of the capacity 10. The capacity 10 is arranged on array and soldered. A ground bag body 2c can secure wide width, so the inductance value becomes small, the high-frequency noise removing operation of the filter is not impeded, and a noise voltage is lowered, so that the chip type noise filter is fitted displaying its characteristics sufficiently.

Inventors

• 👤 Yukio Sakamoto
• 👤 幸夫 坂本
• 👤 Toshimi Kaneko
• 👤 金子　敏己
• 👤 Hidetoshi Yamamoto
• 👤 秀俊 山本

Bibliographic Details