Manufacture of electronic component mounting board

Abstract

Abstract PURPOSE:To improve connecting reliability of a conductor circuit to a lead and to form through holes in high density by forming a base material of fusible resin, selectively removing to melt the part of the material to form a hole reaching an inner connector, and through hole-plating the holes to form the holes. CONSTITUTION:A base material 13 is formed of fusible resin, and the material 13 is partly selectively removed by melting to form a hole 16 reaching an inner connector 12. The hole 16 is through hole-plated 17 to form a through hole 15. Thus, fine holes 16 can be formed as compared with opening by a general drill, and the holes 15 can be formed in high density. Further, a conductor circuit 14 is electrically connected to a lead 11 with high connecting reliability.

Inventors

• 👤 Mitsuhiro Kondo
• 👤 近藤　光広
• 👤 Naoyasu Enomoto
• 👤 榎本　直泰
• 👤 Kinya Oshima
• 👤 大島　欣也

Bibliographic Details