Resin composition for optical molding

Abstract

Abstract PURPOSE:To obtain the title compsn. providing a cured product with excellent mechanical strengths, hardness, etc., by incorporating a radiation-curable cationically polymerizable org. substance and a radiation-curable radical- polymerizable org. substance as well as a radiation-sensitive cationic polymn. initiator and a radiation-sensitive radical polymn. initiator and a filler as essential components. CONSTITUTION:A radiation-curable cationically polymerizable org. substance contg. 40wt.% or more alicyclic epoxy resin contg. pref. 2 or more epoxy groups in the molecule (e.g., 3,4-epoxycyclohexylmethyl 3,4- epoxycyclohexanecarboxylate), a radiation-sensitive cationic polymn. initiator (e.g., an arom. onium salt), a radiation-curable radical-polymerizable org. substance contg. 50wt.% or more compd. having 3 or more unsatd. double bonds in the molecule (e.g., dipentaerythritol hexaacrylate), a radiation-sensitive radical polymn. initiator (e.g., benzophenone) and a filler (e.g., silica powder) are incorporated as essential components.

Inventors

• 👤 Kazuo Okawa
• 👤 和夫 大川
• 👤 Seiichi Saito
• 👤 斉藤　誠一

Bibliographic Details