Patent JPH0270784A successfully refreshed from Google Patents.
← Back to Patent Explorer
JPH0270784A Expired / Lapsed JP ⏱️ 0.0 years remaining

Adhesive composition

Assignee: OOSHIKA SHINKO KK
•
Filing: 1988-09-07
•
Granted: —
•
Expires: 2008-09-07
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE:To obtain an adhesive composition, as a plywood adhesive, improved in adhesion to resinous wood and durability and shortened in a hot-pressing time by mixing a formalin condensation resin with an acidified aminoethylated vinyl interpolymer. CONSTITUTION:An adhesive composition is formed by mixing 100pts.wt. (in terms of solid matter) formalin condensation resin (A) (desirably, a condensate of formaldehyde with an amino compound such as urea in a molar ratio of 1.5-2.8, having a solid content of 45-75%) with 0.05-50pts.wt., desirably, 0.5-20pts. wt. acidified aminoethylated interpolymer [a salt of an aminoethylated interpolymer of the formula (wherein R and R<1> are the same or different and are each H or a 1-4 C alkyl, and n is 1.0-2.5 on the average with formic acid or acetic acid].

Inventors

  • 👤 Masaharu Iwasaki
  • 👤 雅春 岩崎
  • 👤 Takashi Yonehara
  • 👤 米原 崇
  • 👤 Hiroyasu Morinaga
  • 👤 博泰 森永
  • 👤 Ichiro Fujii
  • 👤 一郎 藤井
  • 👤 Katsuhiro Oda
  • 👤 小田 勝浩

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-10 01:49
CPC Classifications
—

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag